11/6/2021: Horizon Europe launch, EIC Overseas Trade Fairs, IP Enforcement Summit, EIB funds IE University, research infrastructures, EU semiconductor manufacturing, and EU 2030 digital targets

In today’s Morning Brief: Member states call for Horizon Europe to go full steam ahead || Open Call: The EIC launches the Overseas Trade Fairs Programme 2.0 || International IP Enforcement Summit 2021 || EIB supports IE University in Spain with a financing plan of up to €30 million || ESFRI: the coronavirus pandemic changed research infrastructures || Intel answers EU call to scale up European capacity for semiconductor chips || Analysis: EU will fall short of meeting 2030 digital targets

Read More »

21/05/2021: EIC Transition calls, surveys on research skills and research careers, EC webinars on funding, R&I days, EU Covid Passports, RU research legislative framework, The Guardian key moments, and the Council reading list on AI

In today’s Morning Brief: EIC Transition Calls are open | EC online survey on Skills for researchers | Survey on the influences on research careers | European Commission webinar: The Funding & Tenders Portal for Beginners | European Commission webinar “All you need to know on Dissemination and Exploitation under Horizon Europe” | R&I Days 2021 (reminder) | EU Digital COVID Certificates (aka Passports) should be in use by July 1 | Council complements EU research legislative framework | Weekend Read: The key 200 moments as reported by The Guardian since 1821 | Deep-dive: The EU Council reading list on Artificial Intelligence

Read More »

08/04/2021: Experts wanted for EU funding evaluation, HEU Covid-19 call, hydrogen, biomaterials and post-pandemic innovation approach

In today’s Morning Brief: New call for expression of interest for experts for the programming period 2021-2027
| First Horizon Europe COVID-19 research call to launch next week | High-level conference on Hydrogen | Post-pandemic Europe: HLG advises to learn from innovation and boost key ecosystems | Nanotechnologies transform wood into high-tech material

Read More »